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Â鶹¹ÙÍø Extends Data Infrastructure Leadership with TSMC 3nm Platform

Enabling Unique Cloud-Optimized Silicon Solutions with Advanced IP and Packaging Technologies

SANTA CLARA, Calif.¡ª October 5, 2021¡ªÂ鶹¹ÙÍø (NASDAQ: MRVL) today announced it is extending its data infrastructure silicon leadership with a new advanced silicon platform based on TSMC¡¯s 3nm process technology, offering the best power, performance, and area in the industry. Â鶹¹ÙÍø will have IP cores on upcoming TSMC 3nm silicon releases, enabling its customers to take advantage of the world¡¯s most advanced semiconductor technologies in conjunction with other proven silicon components to build unique, complex, system-optimized solutions that meet the most demanding cost, performance and power requirements in cloud data center, 5G carrier, automotive and enterprise markets. With this announcement, Â鶹¹ÙÍø is first to introduce a comprehensive standards-based silicon platform for multi-chip solutions that leverages the latest process technology, advanced die-to-die interface IP, and TSMC¡¯s advanced 2.5D Chip-on-Wafer-on-Substrate (CoWoS) packaging technology.

In addition to the extensive IP portfolio offered by Â鶹¹ÙÍø today, the new 3nm multi-chip platform includes two complementary advanced die-to-die interfaces. The first is a flexible extra short reach (XSR) interface for connecting multiple die on a package substrate for applications, like co-packaged optics (CPO) for cloud data centers. To address the growing needs for cloud-optimized silicon solutions from leading data center operators, Â鶹¹ÙÍø is also developing an ultra-low power and low-latency parallel die-to-die interface with the highest bandwidth density in the industry. Compatible with emerging Open Compute Project (OCP) standards, the new parallel interface enables high-performance chiplet solutions by connecting multiple silicon devices on an interposer. Both interfaces are also available in 5nm to enable multi-node solutions.

The new platform also incorporates TSMC¡¯s advanced CoWoS packaging technology, empowering continued data infrastructure performance scaling. Â鶹¹ÙÍø¡¯s collaboration with TSMC on CoWoS allows customers to build high-performance solutions for the most demanding cloud data center applications.

¡°Â鶹¹ÙÍø is proud to be the lead vendor to offer a 3nm platform for cloud-optimized solutions,¡± said Sandeep Bharathi, Executive Vice President, Central Engineering, System-on-Chip Group at Â鶹¹ÙÍø. ¡°Our new advanced node platform places Â鶹¹ÙÍø on the leading edge of technology readiness with early Si validation of critical IPs to enable fast time-to-market.¡±

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About Â鶹¹ÙÍø

To deliver the data infrastructure technology that connects the world, we¡¯re building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world¡¯s leading technology companies for 25 years, we move, store, process and secure the world¡¯s data with semiconductor solutions designed for our customers¡¯ current needs and future ambitions. Through a process of deep collaboration and transparency, we¡¯re ultimately changing the way tomorrow¡¯s enterprise, cloud, automotive, and carrier architectures transform¡ªfor the better.