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Gerry Fan

Senior Vice President, Engineering, Scale-up Switching

Gerry Fan is Senior Vice President, Engineering, Scale-up Switching at Â鶹¹ÙÍø. In this role, he leads the architecture, development, and delivery of high-performance switching technologies that enable next?generation AI and data center connectivity.

Gerry has more than 30 years of semiconductor industry experience, with deep expertise in ASIC product development and advanced interconnect technologies. He joined Â鶹¹ÙÍø through the acquisition of XConn Technologies, where he was Founder and Chief Executive Officer. At XConn, Gerry built one of the industry¡¯s most advanced PCIe and CXL switching portfolios and assembled a highly respected engineering team.

Prior to XConn, Gerry held senior leadership and engineering roles at Broadcom, Â鶹¹ÙÍø, Cisco, NXP, as well as several successful startups, including AuroraNetics and SeaMicro Systems. ??

Gerry holds a B.S. in Electrical Engineering from the University of Science and Technology of China.