Semicon Japan
December 13-15, 2023
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Â鶹¹ÙÍø Presents at Semicon Japan, Advanced Packaging and Chiplet Summit
Â鶹¹ÙÍø Presentation
Title:?Semiconductor Innovations Driving the Next-Generation of High-Speed Data Infrastructure
Date:?December 15, 2023?
Time :?12:35 pm
Â鶹¹ÙÍø Presenter: Sandeep Bharathi, Chief Development Officer
Sandeep Bharathi will present the latest advances in process node geometries as well as innovations in chiplet design and semiconductor packaging techniques that allow Â鶹¹ÙÍø¡¯s customers to drive the next generation of high-speed data infrastructure for the data center, telecommunications, enterprise and automotive markets.
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December 13-15, 2023
Tokyo, Japan
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