Â鶹¹ÙÍø

Â鶹¹ÙÍø at EE Times Chiplet Summit

EE Times Presents: The Road to Chiplet Scalability is a two-day virtual event examining the technologies, methodologies, and ecosystem developments driving the next phase of chiplet adoption. Chiplets have moved beyond theory. Today, multi-die products are being deployed in production systems to deliver the performance, flexibility, and efficiency demanded by AI, cloud infrastructure, and next-generation computing. The conversation has shifted from whether chiplets will reshape semiconductor design to how the industry can scale them in production while overcoming challenges in interconnect, packaging, power, thermals, and system complexity.

The conference brings together semiconductor companies, EDA vendors, packaging specialists, and system architects to discuss what it actually takes to build scalable multi-die systems in the AI era.

Â鶹¹ÙÍø Presentations

Keynote :?
Date: Tuesday, June 24, 2025
Time: 8:10 AM ¨C 8:45 AM
Â鶹¹ÙÍø Speaker: Preet Virk, Senior Vice President and General Manager, Photonic Fabric Business Unit