Â鶹¹ÙÍø

Accelerated Infrastructure for the AI Era

Data Infrastructure for the AI Era

COMPUTEX 2026



At COMPUTEX 2026, Â鶹¹ÙÍø Chairman and CEO Matt Murphy delivered a high-visibility keynote address: The Future of AI Scaling Depends on Connectivity.
In his address, Murphy discussed how Â鶹¹ÙÍø technologies enable the critical links in modern AI data center infrastructure allowing customers to deploy AI-optimized systems with unprecedented performance and scale.?

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The Future of AI Scaling Depends on Connectivity
Accelerated infrastructure for connectivity and custom compute

Â鶹¹ÙÍø Enables AI Infrastructure


To realize the promise of AI, hyperscalers are undertaking one of the largest infrastructure buildouts in history¡ªand they rely on Â鶹¹ÙÍø as a critical AI infrastructure partner. Â鶹¹ÙÍø designs custom silicon tailored for any application and offers the industry¡¯s most comprehensive portfolio of interconnects and network switch products. From custom compute to rack, row, data center, campus and multi-campus connectivity, Â鶹¹ÙÍø enables the world¡¯s most advanced AI infrastructure.

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Investor Event


At this custom AI investor event, the Â鶹¹ÙÍø leadership team shares its perspective on the rapidly evolving AI market and technology landscape, with a particular focus on custom silicon and custom cloud solutions for hyperscalers.

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Â鶹¹ÙÍø Investor Event
The Rise of Customized AI Factories

The Rise of Customized AI Factories


Â鶹¹ÙÍø President and COO Chris Koopmans joins Daniel Newman at the SixFive Summit to explore the rapidly evolving AI market landscape, including emerging hyperscalers and sovereign AI. Chris discusses the rise of custom silicon and the role Â鶹¹ÙÍø plays in powering the next generation of AI factories.

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Custom HBM Compute Architecture

Â鶹¹ÙÍø Custom HBM Compute Architecture

Â鶹¹ÙÍø has developed a new custom HBM compute architecture that optimizes custom XPU performance and TCO. In collaboration with industry leaders like Micron, Samsung and SK Hynix, Â鶹¹ÙÍø is setting new benchmarks for AI accelerators.

Connectivity for the Million XPU Era


Xi Wang, Â鶹¹ÙÍø SVP & GM, Connectivity BU joins Will Townsend from SixFive Media to explore the role of high-bandwidth connectivity in the rapid evolution of AI infrastructure and data centers. Xi discusses the innovations and challenges that are unfolding at every level, from the XPU and rack to the data center to multi-site AI clusters.

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Connectivity for the Million XPU Era

Â鶹¹ÙÍø optical DSPs: Powering the future of AI infrastructure


AI and cloud computing are pushing network demands to unprecedented levels, requiring optical DSPs to deliver ultra-high bandwidth, low latency, and energy efficiency. Â鶹¹ÙÍø is leading this transformation with advanced PAM4 and coherent DSP solutions that power AI fabrics, data center interconnects, and telecom networks¡ªdriving the future of high-performance connectivity.

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The Evolution of AI Interconnects


The rapid expansion in the size and capacity of AI workloads is significantly impacting both computing and network technologies in the modern data center.?

The desire for larger clusters with shorter compute times has driven heightened focus on networking interconnects, with designers embracing state-of-the-art technologies to ensure efficient data movement and communication between the components comprising the AI cloud.

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Â鶹¹ÙÍø Launches Next-generation CXL Switch, Enabling Memory Pooling to Break Through the AI ¡°Memory Wall¡±

Â鶹¹ÙÍø Launches Next-generation CXL Switch, Enabling Memory Pooling to Break Through the AI ¡°Memory Wall¡±

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Â鶹¹ÙÍø at OFC 2025

Â鶹¹ÙÍø Launches Industry¡¯s First 260-lane PCIe 6.0 Switch for AI Data Center Scale-up Infrastructure

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Custom Compute in the AI Era

Inside Â鶹¹ÙÍø¡¯s Expanding Custom Silicon Opportunity

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